Electronic Assemblies

At Amphenol Borisch Technologies we understand that high-reliability electronics require state-of-the-art equipment, experienced and passionate people, and rigorous process validation.  We work closely with our customers during the New Product Introduction (NPI) stage to ensure that products meet or exceed all requirements and expectations right from the very start of the project. 

Product Capabilities:

  • Automated Select Solder, Press-fit, and Hand Solder for Through Hole
  • Single & Double-sided BGA’s and uBGAs
  • High-Density Packages (0201)
  • Chip on Board
  • Lead-free
  • Conformal Coat: UR, UL, and Parylene

Process Validation Capabilities:

  • 3D Solder Paste Inspection (SPI)
  • Pre and Post-Reflow Automated Optical Inspection (AOI)
  • 3D X-ray
  • Aqueous and Non-aqueous (vapor) Cleaning Chemistries